M3: IP-driven innovation for GHz–THz EMC and contactless IC testing

M3 works with semiconductor and electronics companies to reduce GHz–THz EMC risks through paid PoC, licensing, and joint development.

Discuss a PoC Solutions & Business Model

Three Strengths

Non-contact evaluation for the GHz–THz era

We develop non-contact approaches that enable evaluation and verification in the GHz–THz range, where conventional probing becomes a bottleneck.

Evidence-backed innovation with IP

Our technology is supported by academic collaborations, publications/awards, and patents—combining theory, validation, and intellectual property.

Pragmatic adoption starting with paid PoC

We start with a paid proof-of-concept, then scale to licensing or joint development based on outcomes.

Services

📡

Non-contact semiconductor self-test

A concept to reduce setup time and enable scalable verification for high-frequency devices.

🧩

Geometric optimization of terminals/structures

Design support to control resonance and radiation characteristics for EMC risk reduction.

🤝

Technology PoC and joint research

We work with partners from problem definition to validation, leading to joint R&D and productization.

Message from the CEO

Operating frequencies are steadily moving toward the next era. M3 is committed to turning “hard to measure” into “measurable” in the GHz–THz domain, where evaluation methods are still evolving.

Hiroshi Kamiya, CEO, M3 Corporation

What we do

Contactless IC testing (GHz–THz)

Non-contact evaluation concepts enabling faster setup and scalable validation.

GHz–THz EMC measurement & optimization

Evaluation and design support for next-generation high-frequency electronics.

Low-power / low-noise interconnect design

Power integrity and noise-reduction design techniques for advanced systems.

How we work

Step 1: Paid PoC — feasibility study and validation with partners.
Step 2: Licensing — technology transfer / IP licensing based on PoC results.
Step 3: Joint development — co-development toward productization and standardization.

Figures (concept)

Concept figure: contactless IC testing and expected impact — Contactless IC testing concept and expected impact (CAPEX, CO₂, setup time).

Concept figure: GHz–THz EMC measurement and optimization — GHz–THz EMC measurement and optimization concept (geometry-optimized components).

Quick facts

Japan-based R&D company with patent-centric technology creation.
Collaboration with academia and industry partners; PoC-first approach.
Focus areas: semiconductor evaluation, EMC, interconnect design, and related IP.

News & Publications

For press articles, publications, and patent updates, please see the Technology page.

View News & Publications Technology